Base
material substrates include:
Aluminum,
Copper Based Alloys, Ferrous
Based Alloys, Nickel Based Alloys,
and Zinc Die Cast
ZINC ELECTROPLATE
NICKEL ELECTROPLATE
· Bright
or Ductile
ELECTROLESS NICKEL
· Mid Level
Phosphorous
· Other Levels Available
· EN/Teflon
PRECIOUS METALS
· Gold
· Silver
· Other Finishes Available
ADDITIONAL COATINGS
· Cadmium
· Copper
· Nickel/Chrome
· Tin (Matte and Bright)
PLATE ON ZINC DIE CAST
· Copper
· Electroless Nickel
· Nickel (electrolytic)
· Zinc Electroplate
· Other Finishes Available
CHEMICAL CLEANING &
CLEAN ROOM PACKAGING
Metal Finishing Technologies, Inc. provides
chemical cleaning, coating removal and clean room packaging of semiconductor
components.